Asahi Kasei has announced its new photosensitive film for panel-level packaging in the semiconductor industry, combining the features of its photosensitive polyimide (PSPI) and dry film photoresist (DFR).
The company says the PSPI film is currently under customer evaluation, with commercial availability expected in the near future. It was developed by combining Asahi Kasei’s PIMEL liquid PSPI used for buffer coatings and passivation layers with its SUNFORT dry film photoresist, for temporary lithographic circuit patterning on substrates and wafers.
The film is hoped to improve productivity in semiconductor packaging manufacturing by enabling easy, uniform application of a lamination process to large square panels. It is also designed to accommodate an increased number of insulating layers and is expected to be applied to redistribution layers for semiconductor packaging and insulating layers for package substrates.
Asahi Kasei states that blending the PSPI film with the SUNFORT TA series allows both fine circuit patterns and insulating resin layers to be formed by film lamination. The company adds it is developing solutions that combine the PSPI film with the SUNFORT CX series, enabling the formation of high-aspect-ratio copper pillars required for three-dimensional semiconductor packaging.
Smart Planet Technologies recently introduced its HyperBarrier PE film, said to deliver ‘300 times’ the oxygen barrier performance of standard PE film and be recyclable in the PE stream under the EU Packaging and Packaging Waste Regulation (PPWR). The film can be configured as a single LDPE-based monolayer or as a three-layer coextrusion depending on the application.
In related news, noriware offers a seaweed-based top seal film for fruit and vegetable packaging, intended to help retailers align with the Packaging and Packaging Waste Regulation’s single-use plastic ban for fresh produce. It is believed to reduce CO2 emissions by 89% compared to conventional plastics.
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