At the leading trade fair Anuga FoodTec in Cologne, Leybold presents its vacuum technologies for the food processing and packaging industry from the 20th to the 23rd March 2018.
In order to read this article, you must be a Packaging Europe subscriber. By becoming a subscriber, you get access to unmissable exclusive content like this, as well as enhanced personalisation options. The good news is that it’s completely free and very simple to subscribe - click the button below to learn more.
—>