All Technology articles – Page 8
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Article‘Fully biodegradable’ corn starch material seeks to replace traditional plastics
Corn Next has officially launched CornNext-17 - its bio-based material designed to replace traditional plastics and support global sustainability initiatives – accompanied by its CornNext-17 White Paper report.
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ArticlePlaybook lays out guidelines for mechanical recycling of mixed plastic waste
In its new Solution Model playbook, the Alliance to End Plastic Waste outlines its approach to converting mixed plastic waste into products of value – keeping investment and technology requirements minimal to ensure its accessibility for countries with less developed recycling systems.
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Article‘First’ packaging-and-label-free shipping pilot conducted by bpost
A pilot project run by bpost allows customers to post items without packaging or labels by delivering them to and collecting them from lockers accessed via smartphone.
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ArticleEverything you need to know about digital product passports
With the Ecodesign for Sustainable Products Regulation (ESPR) expected to become operational in 2027 and the European Commission due to propose Digital Product Passport (DPP) content for certain product groups, Daniel Sabin Diaz, global senior solutions consultant at Systech, outlines the potential impact on data carrier printing, data exchange and stakeholder responsibilities.
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ArticleTentoma aims for high-speed wrapping with new vacuum unit
Tentoma Packaging Solutions has launched a new vacuum unit to collect excess film snippets from its RoRo StretchPack packaging machines, aiming to ensure stable packaging line operation and high-speed wrapping.
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ArticlePlatinum Press upgrades headquarters with Durst and Koenig & Bauer printers
In a $15 million (€14,383,575) expansion and infrastructure enhancement, Platinum Press has installed new Koenig & Bauer and Durst printing presses and unlocked nearly 50% more floorspace for healthcare packaging production at its Fort Worth headquarters.
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ArticleReusable smart label from Giesecke+Devrient unlocks IoT tracking and more
Giesecke+Devrient has revealed the reusable, ‘ultra-thin’ G+D Smart Label, which embeds IoT features into a package and enables location tracking, tamper protection, proof of delivery, and more.
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ArticleX-Rite seeks improved efficiency with new LED lighting booth
X-Rite has announced its Judge LED light booth, designed to ensure compliance with environmental regulations and help brands and suppliers transition to LED-based colour assessments without operational disruptions.
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ArticleOPRL to adopt Recyclability Assessment Methodology for packaging EPR
OPRL plans to adapt its Recyclability Assessment Tool to fully align with the Recyclability Assessment Methodology (RAM) for packaging EPR published by Defra, which it describes as ‘valuable clarification’ for businesses and labelling.
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ArticleThe packaging stories and trends to follow in 2025
The Packaging Europe editorial team kicks off the New Year with its predictions for the packaging industry in 2025, from business trends and legislation to popular materials and technological advancements.
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Article‘Self-repairing’ plastic from Bournemouth University to tackle plastic waste
Researchers at Bournemouth University claim to have developed a ‘self-repairing’ plastic that maintains most of its original strength after being damaged, which is hoped to help cut down on plastic waste.
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ArticleAmazon boxes devices with more recyclate, less ink, and tactile QR instructions
New, circularity-minded packaging designs for Amazon’s Echo, Kindle, and Fire TV products claim to use an average of 30% more recycled fibre content and 60% less ink, with a tactile-marked QR code intended to guide visually impaired consumers through the setup process.
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ArticleSeaCube decarbonizes logistics with reefer leases and battery-powered gensets
SeaCube seeks to reduce emissions in refrigerated transport via reefer leases – powered by Greensee’s AI-driven CO2 emissions reporting technology – and battery-powered container gensets tested alongside Thermo King and CMA CGM.
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ArticleDS Smith wins award for virtual reality learning experience
DS Smith’s Operations Learning Academy (OLA) has won an award within the Best International Project category at the Uptale Awards for its Virtual Reality (VR) learning experience, used to create real-life scenarios for colleagues in the packaging division.
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ArticleMondi mill upgrades to lower emissions and bolster operations in 2025
From the first quarter of 2025, Mondi expects to lower nitrogen oxide emissions by up to 10%, greenhouse gas emissions by over 20%, and gas consumption by about 25% at its fine paper mills in Neusiedler, which have been upgraded under a €20 million investment.
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ArticleRe-Gen uses Polytag watermarks to track packaging among mixed waste recycling
Re-Gen is utilizing Polytag’s watermarking technology to accurately count individual items of packaging among the 250,000 tonnes of mixed household waste recycled at its Newry material recovery facility every year.
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ArticleEU-funded project recycles multi-layer plastic flexibles into new food-grade packs
The EU-funded CIRCULAR FoodPack project has successfully recycled flexible plastic multilayer composites (MLCs) into food-grade polyethylene packaging using tracer-based sorting technology, water-based treatment, and solvent-based recycling.
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ArticleVideojet laser marking technology seeks to improve coding flexibility
Videojet Technologies has announced its new 7920 UV laser marking system aiming to boost ease-of-use, flexibility and reliability in coding operations for the consumer packaged goods, parts marking and pharmaceutical industries.
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ArticleTetra Pak invests in Dutch plant recycling polyAl from drinks cartons
Tetra Pak and Yellow Dreams are making a joint investment of around €3 million to launch operations at a recycling plant for polyAl from used beverage cartons – set to begin operations in the second half of 2025 and boost recycling capacity in the EU.
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ArticleSemiconductor manufacturers receive government funding for U.S. production
In order to bolster semiconductor manufacturing in the United States, SkyWater Technology and Intel Corporation could receive combined investments of up to $7,876,000,000 under the CHIPS for America programme, administered by the U.S. Department of Commerce.