Norsdon Electronics Solutions’ fluid dispensing platform for panel-level and advanced semiconductor packaging aims to meet the throughput and yield demands of artificial intelligence and high-performance computing.
Compared to wafer-level operations, panel-level packaging is set to unlock higher throughput and lower manufacturing costs – especially as package sizes increase and throughput demand rises due to artificial intelligence applications and automotive electrification.
Scaling large-format panels is expected to introduce challenges such as warpage control, thermal management, and dispensing accuracy. Each requires specialized process controls.
The ASYMTEK Vantage XL Fluid Dispensing System is based on the Vantage system, but provides a larger platform frame to accommodate common panel sizes. It is anticipated to help scale production with greater accuracy, throughput, and process control.
The system is designed to improve dispensed underfill flow and warpage mitigation for void-free results. Flexible tooling support is available for large panel sizes during semiconductor manufacturing.
Integrated thermal management is set to facilitate uniform heating and temperature across the substrate, while multi-fiducial capture is expected to ensure fast, accurate alignment.
ASYMTEK Vantage XL Fluid also offers confocal height sensing for reflective and transparent glass panels, and post-dispense inspection for efficient and process rework.
Norsdon will showcase its new system, alongside its new MARCH ExoSPHERE plasma treatment system for advanced packaging processes, at SEMICON Taiwan 2026 (Booth I2308).
Packaging Europe previously visited Nordson’s stand at K, where its PolyNeo Melt Pumps were on display. This development was anticipated to meet the ever-higher demands of polymer processing without impacting product quality.
Engineered with advanced heating technology, the pumps sought to achieve throughputs of up to 20 tons per hour while keeping downtime and service complexity at a minimum.
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