The BOBST AluBond® process provides high metal adhesion and surface energy levels through vacuum metallization.
A common problem is poor metal adhesion due to de-lamination
Traditional metallization, even with plasma treatment, can result in poor metal to polymer substrate bonding, this produces de-lamination which leads to packaging failure and results in product rejects and loss of reputation.
Part of the problem is low surface energy on the metal side which also contributes to poor lamination bonding. There is increasing demand in the industry for higher levels of metal adhesion on metallized film due to the need for more complex packaging structures which requires a lamination peel strength suitable for functional needs.
BOBST AluBond® eliminates the need for chemically treated films
BOBST has developed an innovative approach to address this common issue in the packaging industry through its vacuum metallizers, eliminating the need for chemically treated films.
High bonding strength is achieved on any substrate with the BOBST AluBond® unique metallizing process. This is an advanced metal adhesion technology where metal adhesion values can be achieved of up to 5N/15mm.
What is BOBST AluBond®
The BOBST AluBond® process is an in-line hybrid coating technology which promotes chemical anchoring (chelation) of the first aluminium particles creating a metallizing seeding layer that provides superior bond strength properties.
Very high adhesion is achieved when there are direct chemical bonds between the aluminium coating and the polymer surface. Increased chemical bonding by the creation of the seeding layer increases lamination bond strength and leads to high performance during lamination, extrusion and coating processes hence preventing failure of the packaging.
Increases in Metal Adhesion and Dyne Level Retention
BOBST AluBond® has been shown to greatly increase metal bond strength and metal adhesion on the most commonly used substrates (PET, BOPP, CPP and PE) during aluminium vacuum metallization.
In addition BOBST AluBond® has also been shown to significantly increase dyne level retention which translates in improved ink wettability during printing and enhances structure stability during lamination. BOBST AluBond® generates added value by extending surface energy stability on metallized films over a long period of time and may eliminate the need for an additional surface treatment boost i.e. corona refresh prior to converting.