Researchers at the University of Illinois Chicago have developed a range of coatings for industrial surfaces that use a specialised chemical composition to delay the formation of ice, helping to prevent damage to the product. Dr Rukmava Chatterjee discusses how they can be used to complement multiple packaging applications across the supply chain while offering a lower environmental footprint than typical anti-freeze alternatives.
NXP Semiconductors has released a new family of Near Field Communication (NFC) integrated circuits (ICs) featuring tamper-detection and condition-monitoring functionality on a single chip for consumer brands, healthcare and smart-home applications.
G. Mondini has trialled TIPA’s compostable films as liners for its paper-based packaging solutions for wet, chilled, frozen, and fresh food products.
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