This Autumn (Fall) AIPIA is offering two unmissable opportunities to get connected to the latest developments in Active and Intelligent packaging technologies and services.
First up is the Smart Packaging Summit in Chicago (25th October) at Pack Expo International. This is followed by the welcome return of the AIPIA World Congress at the iconic Beurs van Berlage in the centre of Amsterdam, Netherlands. Both events are being organised in conjunction with our partners Packaging Europe.
The Chicago event offers a deep dive into Smart Packaging as a marketing tool, showing the latest ideas on how to stay connected to Customers and meet their needs, as well as building Brand trust. Featured speakers include Amber Walls, Senior Director, Global Standards, GS1 US (the era of 2D barcodes); Adhithi Aji, Founder & President, Adrich (Driving Consumer Engagement and Incremental Purchases): and Chris Braine CEO & Founder, Cellr Pty Ltd (Ultra Personalisation and Smart Packaging.)
The full agenda can be seen here, giving details of the top lineup of speakers, including Aptar, Digimarc, Identiv, Systech, Securikett as well as many more.
This is a great opportunity to visit the largest North American packaging and processing technology event and catch up on some of the most exciting Smart Packaging products and services currently available at the same time. In this fast-moving sector, something new is happening. Make sure you keep up to date, book now!
November sees the World Congress which is the only event offering a comprehensive overview of the state-of-the-art in Smart Packaging. Whether it’s food safety & security, extending shelf-life, supply chain management, consumer engagement, compliance, anti-counterfeiting, authentication or blockchain which sits high up on your agenda, there is something for you in Amsterdam.
Importantly AIPIA is pleased to announce the return of one of the most dynamic elements of the World Congress. The Congress will play host to TWO Brand Challenges in 2022 featuring Haleon and Marks & Spencer (M&S) who invite AIPIA members to pitch their ideas on how to offer solutions to particular smart packaging requirements. Full details will be available very shortly. Interested companies can apply to be considered to take part in either Challenge, contact Eef de Ferrante for more information at eef@aipia.info
The World Congress agenda is already packed with a fantastic lineup of speakers and is still growing. From our regular leaders in their field, come Zappar (Augmented Reality), Avery Dennison (RFID), GS1 (Barcode standardisation) and Securikett (Digitisation of on Pack Security). AIPIA is maintaining its tradition of adding fresh faces with fresh ideas. So we welcome SoFresh (Shelf Life improvement and the Impact of GHG emissions), MidiaCode (Smart Packaging at Scale), Algramo (the Reuse Revolution) and collectID (Blockchain using NFC technology) to name only some. The current agenda can be seen here.
So if you are staying Connected, Reconnecting or wanting to Connect with Smart Packaging, it’s time to book your place in Amsterdam (or Chicago) and meet some of the smartest Smart Packaging providers on the planet. Only AIPIA provides a complete picture of the sector. To register as a delegate at the World Congress click here.
This article was created in collaboration with AIPIA (the Active and Intelligent Packaging Industry Association). Packaging Europe and AIPIA are joining forces to bring news and commentary about the active and intelligent packaging landscape to a larger audience. To learn more about this partnership, click here.
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