Bostik unveils high-performance solvent-less laminating adhesive for retort applications

Bostik, a global leader in adhesive technologies, is proud to announce the launch of its new solvent-less laminating adhesive, specifically engineered for retort applications. This advanced adhesive solution is designed to withstand extreme conditions—up to 135°C for 1 hour—while delivering exceptional bond strength on challenging substrates such as aluminum foil, SiOx, and AlOx-coated films.

Performance meets sustainability

This aliphatic adhesive meets PAA-free requirements. It can be coated at just 2–2.5 g/m², contributing to the structure cost efficiency. Combined with its solvent-free formulation, this adhesive significantly lowers emissions during production, supporting converters in their sustainability goals.

A value chain collaboration for circular packaging

At K Fair 2025, Bostik has introduced a mono-material PP retortable pouch developed in collaboration with key players across the packaging value chain:

· Nordmeccanica: Triplex 1 Shot Lamination equipment offering exceptional efficiency

· Toyo Ink: Water-based inks allowing low-emission printing

· Hyper Cast: Cast PP film providing structural integrity

· Toppan: Retortable high barrier film ensuring shelf-life and product protection

This pouch is designed with *over 90% polypropylene (PP) content, fully aligned with CEFLEX guidelines for design for recycling. The combination of solvent-less adhesive and water-based ink ensures minimized emissions while maintaining high-performance standards.

Click here to learn more about this pouch.

Driving Innovation in Retort Packaging

Bostik’s new adhesive solution empowers converters and brand owners to meet the dual challenge of technical performance and environmental responsibility. It enables high-speed lamination, excellent wet-out, and robust thermal resistance—making it ideal for ready meals and other demanding applications.

“This launch is a testament to Bostik’s commitment to innovation and sustainability. By working closely with partners across the value chain, we’re delivering a solution that meets the highest standards of performance, recyclability, and environmental stewardship.” — Hervé Cavalié, Global Flex Director, Bostik

Visit Bostik at interpack 2026

Join Bostik at interpack in Düsseldorf from 6th to 13th of May 2026 to explore the company’s broad portfolio and other innovative co-developments. Discover how smart chemistry can drive the future of sustainable packaging.

For more information, visit bostik.com or contact your local Bostik representative.

This content was sponsored by Bostik.