In this week’s biggest stories from the packaging industry, FEFCO released guidelines on optimising recyclability via design parameters for paper and board packaging, and we got two opposing views on France’s incoming plastic packaging ban.
In case you missed it, our latest Sustainable Packaging Summit discussions took a look at circularity and bioplastics. Click here to watch them.
Also, don’t forget to catch up on our latest Wider View feature, in which Toray puts the case forward for offset Electron Beam (EB) technology as a means for the packaging value chain to reduce its overall carbon footprint.
