On October 12, 2017, the third International Conference on Innovative Solutions for Flexible Packaging will take place in Kiev, Ukraine.
This year, innovations in flexible packaging and industrial films will be presented by leading industry players including The Dow Chemical, Mitsui Chemical, UBE, Kuraray, UTECO Converting, HP Indigo, Kodak and other companies. They will demonstrate their latest technologies for production of polymers and adhesives, solutions for processing, printing, and converting, as well as developments in packaging waste recycling.
Dow will talk about new products: InnateTM, RetainTM and EliteTM, which allow to decrease packaging wait and enable films with specials properties. Also will be presented information about innovations in laminating adhesive.
Kodak will highlight Kodak Flexcel NX System for flexographic plate production. Flexcel NX is a unique, patented film-based technology producing plates that drive unparalleled quality and consistency on press, increasing uptime and enabling no-compromise offset and gravure conversions across a wide range of flexo print applications.
In a joint presentation Kuraray and UBE will advocate the audience about the importance of oxygen barrier and mechanical properties of multi-layer films. Reduction/avoidance of food waste and a more sustainable approach to the perception of shelf life is crucial issue in today´s retailing. The solutions offered by Kuraray’s EVAL™ EVOH and UBE NYLON polyamide portfolio not only increase exponentially the shelf life of the packed food, they also ensure superior mechanical resistance against potential damages and the loss of the oxygen barrier.
Innovative Solutions for Flexible Packaging industry conference is an effective way to establish direct communication between suppliers of latest technologies and companies representing the flexible packaging industry. The conference, with its both formal and informal networking opportunities, makes it easy to communicate advantages of new solutions quickly and clearly. Developers and suppliers of innovative technologies will focus on the efficiency of their solutions for production, promotion, lean manufacturing. Special attention will be paid to the ways to improve quality and safety of end products. The program features case studies of new product development with much shorter time-to-market. Alongside the conference, the exhibition will present both new and popular solutions for manufacturing of various packaging films and extruded materials for industrial packaging.
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