On October 25, 2018, RadTech Europe will host its biennial UV and EB for Food Packaging Seminar at Mövenpick hotel Stuttgart Airport.

The seminar will be held in English, and RadTech Europe members and non-members are both welcome to attend.

The event will focus on all aspects of UV/EB and UV-LED for food packaging: the technological developments in UV, EB and UV inkjet, the regulatory requirements, the vision of brand-owners and real-life examples of converters applying the technology for their food packaging products.  

The event offers participants the opportunity to meet industry experts in materials, inks, printing, equipment and packaging, as well as regulatory affairs for the radiation curing industry. Confirmed companies and organizations speaking include Nestlé, Bobst, OPM, BASF, Allnex, the European Printing Ink Association and more. The event is targeted at the entire food packaging value chain, with a special focus on and reduced fee for food packaging converters. An early bird discount will be available for participants registering before the 1st of July. 

For more information, such as the seminar program and registration details, visit https://www.radtech-europe.com/events/rte-food-packaging-seminar-2018