Henkel Adhesive Technologies has combined 49% directly biobased raw materials and 30% ISCC-certified mass-balanced material into a new hot melt expected to save an annual 7,500kg of CO2 in folding carton, tray, and wrap-around packaging applications.
The Technomelt Supra 079 Eco Cool hot melt adhesive claims to bond packaging at a processing temperature up to 40°C lower than other solutions. Henkel anticipates that this will consume less energy, as well as also benefit operating personnel by decreasing the risk of burns and reducing exposure to vapours and volatile substances.
Furthermore, it is thought to reduce CO2 emissions by up to 32% compared to a premium polyolefin-based hot melt – which, assuming an adhesive consumption of 7 tons per year, is calculated to save around 7,500kg of CO2 every year. This calculation is based on a cradle-to-gate analysis of the product’s carbon footprint, excluding the use phase and end-of-life emissions.
The adhesive is also certified by cyclos-HTP as compatible with the paper recycling process, while its ISCC certification is set to achieve the correct volume of certified and non-certified material within the product – 30% certified mass balanced material and at least 49% direct biobased content.
All together, these features are hoped to help companies optimize the sustainability of their packaging in the raw materials and processing stages of the value chain.
Nele Gering, sustainability manager Europe at Henkel Consumer Goods Adhesives, commented: “With Technomelt Supra 079 Eco Cool, we are addressing several trends and challenges in the packaging industry.
“Increasing regulations and consumer preferences for sustainable packaging practices and materials are putting pressure on companies to innovate in the area of sustainable packaging design.
“We are pleased to launch a product that is particularly suited to responsible companies: It reduces CO2 emissions, can improve process efficiency and is fully compatible with the paper recycling process.”
In similar news, Henkel recently worked with Dow and Kraton Corporation to lower the carbon footprint of its Technomelt Supra 100 LE and Technomelt Supra 106M LE – both available with biobased alternatives and designed for end-of-line packaging. The lower-emission formulations are still believed to provide the same performance and food-safe properties as the legacy designs.
Meanwhile, Power Adhesives has launched its ‘world first’ biodegradable hot melt adhesive, designed to be used on cartons, corrugated packaging, and more. It is said to be manufactured with 44% bio-based materials and certified to ASTM D6400 and EN13432 standards.
Sasol Chemicals also reports that its industrial wax grade for use in packaging adhesives, SASOLWAX LC100, reduces carbon footprint by 35% and achieves cradle-to-gate Product Carbon Footprint benefits. Like Sasol’s industry standard SASOLWAX H1, SASOLWAX LC100 is said to combine with metallocene polymers to form odourless, clear HMA formulations with low viscosity, high crystallinity, and stability.
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