Arburg at the Interplastica 2018: High-performance for the Packaging Industry

arburg241117.jpg

At the Interplastica 2018, to be held in Moscow (Russia) from 23 to 26 January, Arburg will present a high-speed thin-wall application for the packaging industry in hall 21, stand 21B25.

 ALREADY A REGISTERED USER? SIGN IN now

 

Subscribe (for free) to read this article

Become a subscriber to read this story, as well as other exclusive articles and interviews. The process is entirely free and takes no time at all.